Method for coating substrates and carrier substrates

ABSTRACT

The present invention relates to a method for coating substrates, including applying a composition to a first side of the substrate, the composition containing an inorganic compound, drying the applied composition, applying at least one coating to the first side of the substrate to which the composition is applied, the coating containing a silane, drying the applied coating, and applying at least one barrier layer to a second side of the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. Ser. No. 12/161,031filed Jul. 16, 2008, which is the national stage of InternationalApplication No. PCT/EP06/070249 filed Dec. 28, 2006, which claims thebenefit of priority of German Application No. 10 2006 008 130.7 filedFeb. 20, 2006. This application is also a continuation-in-part of U.S.Ser. No. 10/588,952 filed Apr. 25, 2007, which is the national stage ofInternational Application No. PCT/EPO4/053577 filed Dec. 17, 2004, whichclaims the benefit of priority of German Application No. 10 2004 006612.4 filed Feb. 10, 2004. The entire contents of these applications arehereby incorporated by reference.

The present invention relates to a method for coating substrates, andcoated substrates obtainable by the abovementioned method.

There is in the prior art a need for changing or for improving thesurface properties of substrates by coating. In particular, the hardnessor the resistance to aggressive substances can be improved by coatings.The substrates which are coated may have very different properties. Inthe area of building materials, a very wide range of substrates isknown. Suitable substrates are hard, i.e. non-flexible, substrates, suchas, for example, stones or non-flexible tiles. These are installed invery different areas, for example of a house. However, there is also avery large range of use for flexible building materials. Flexible tileswhich can be used, for example, as water-tight cladding of swimmingpools may be mentioned in particular here. The flexible buildingmaterials have the advantage that they can adapt to the subsurfacewithout complicated adaptation of the substrate being necessary. Inaddition, forms which are not achievable at all or are achievable onlywith difficulty using rigid building materials can be realized withflexible building materials.

Moreover, there is a growing need for coated veneers, such as, forexample, floor panels or items of furniture, which are equipped with aresistant and scratch-resistant surface. Particularly in the case ofhigh-quality veneers, the requirements with regard to the surfaceproperties are constantly increasing.

Common to all these substrates is that they must have a surface whichmust meet a very wide range of requirements. One requirement is thatthere must be resistance to aggressive chemicals or environmentalinfluences. On the other hand, it is advantageous in other areas if thebuilding materials have little tendency to becoming soiled.

On the other hand, in other areas too, such as, for example, wovenfabrics and knitted fabrics, there is the possibility of improvingsurface properties by coatings. Here, the stability of a composite isensured by the underlying substrate while the resistance to aggressivesubstances or the tendency to becoming soiled is ensured by appliedcoatings.

In the case of flexible substrates, it is necessary in particular forapplied coatings to be so flexible that they follow any deformation ofthe flexible substrate without impairment of their structure. If aflexible substrate is bent, stresses occur at the surface of thesubstrate. These stresses must not, however, result in the coating of asubstrate being impaired, as, for example, by cracking. Particularly inthe case of a flexible substrate which serves as edge protection, anapplied coating must not tear even in the case of a large bending angle.

Thus, the prior art discloses methods for applying coatings to flexiblesubstrates without the coating being adversely affected by deformationof the substrate.

WO 99/15262 discloses a permeable composite material. Here, a coatingwhich is subsequently cured is applied to a permeable support. Thecoating contains an inorganic component, the inorganic componentcomprising at least one compound of a metal, semimetal or mixed metalwith at least one element of the third to seventh main group of thePeriodic Table of the Elements. The coating composition can be obtainedby hydrolysis of a precursor. A sol can form here and is subsequentlyapplied to the permeable substrate. The permeable composite materialsdisclosed in WO 99/15262 are distinguished in that no impairment of theapplied coating occurs even in the case of very small radii of curvatureof the composite material.

There is, however, a further need for influencing the surface propertiesof such flexible substrates. Such influencing of substrates can beeffected, for example, by coatings which are applied by the sol-gelmethod. In the case of the sol-gel coatings disclosed in the prior art,however, there is the problem that they can be applied only inrelatively thin layer thicknesses. In addition, the sol-gel coatings ofthe prior art are not suitable for application to flexible substratessince they crack on mechanical deformation of the substrate. As a resultof this cracking, it is no longer ensured that the substrate iscompletely protected by the coating. Rather, aggressive substances canpass through the resulting cracks to the substrate and adversely affectthe latter.

In particular, it is not possible with the method of the prior art toapply sol-gel coatings with a large layer thickness to flexiblesubstrates.

The technical object of the present invention is to make availablecoated substrates which have a coating which reliably protects thesubstrate from environmental influences, it also being possible for thesubstrate to be flexible and the coating not being adversely affected bya deformation of the substrate. In particular, adhesives which serve forfastening the substrate should not adversely affect the properties andin particular the surface properties of the coated substrate. A furtherobject of the present invention is to make available a method forproviding such improved substrates.

The technical object of the present invention is achieved by a methodfor coating substrates, comprising the steps:

-   -   a) provision of a substrate,    -   b) application of a composition to a first side of the        substrate, the composition containing an inorganic compound and        the inorganic compound containing at least one metal and/or        semimetal selected from the group consisting of Sc, Y, Ti, Zr,        Nb, V, Cr, Mo, W, Mn, Fe, Co, B, Al, In, TI, Si, Ge, Sn, Zn, Pb,        Sb, Bi or mixtures thereof and at least one element selected        from the group consisting of Te, Se, S, O, Sb, As, P, N, C, Ga        or mixtures thereof,    -   c) drying of the composition applied in step b),    -   d) application of at least one coating to the first side of the        substrate to which the composition is applied in step b), the        coating containing a silane of the general formula (Z¹)Si(OR)₃,        in which Z¹ is R, OR or Gly (Gly=3-glycidyloxypropyl) and R is        an alkyl radical having 1 to 18 carbon atoms and all R may be        identical or different, oxide particles selected from the oxides        of Ti, Si, Zr, Al, Y, Sn, Zn, Ce or mixtures thereof, a polymer        and an initiator, and    -   e) drying of the coating applied in step b),    -   f) application of at least one barrier layer to a second side of        the substrate, and    -   g) optional application of at least one layer containing at        least one adhesive (adhesive layer) to the barrier layer applied        in step f).

The first side of the coated substrate is the side which is visibleafter use in the intended manner. Accordingly, the second side of thecoated substrate is the side with which the coated substrate is appliedto a subsurface on use in the intended manner. Preferably, the secondside of the substrate is the back of the first side of the substrate.

The method of the present invention is not limited to specificsubstrates. The substrates may be both open-pore and closed-pore. Inparticular, the substrate in step a) may be a flexible and/or rigidsubstrate. In a preferred embodiment, the substrate of step a) is aknitted fabric, a woven fabric, a mesh, a film, a sheet-like structureand/or a metal sheet.

The substrate in step a) is preferably substantially thermally stable ata temperature greater than 100° C. Preferably, the substrate in step a)is substantially thermally stable under the drying conditions of stepsc) and/or e).

In a preferred embodiment, the inorganic compound of step b) is selectedfrom TiO₂, Al₂O₃, SiO₂, ZrO₂, Y₂O₃, BC, SiC, Fe₂O₃, SiN, SiP,aluminosilicates, aluminium phosphates, zeolites, partially exchangedzeolites or mixtures thereof. Preferred zeolites are, for example,ZSM-5, Na-ZSM-5 or Fe-ZSM-5 or amorphous microporous mixed oxides whichmay contain up to 20 percent of nonhydrolysable organic compounds, suchas, for example, vanadium oxide/silica glass oralumina/silica/methylsilicon sesquioxide glasses.

The inorganic compound of step b) preferably has a particle size of 1 nmto 10 000 nm. It may be advantageous if the composite material accordingto the invention has at least two particle size fractions of the atleast one inorganic compound. It may also be advantageous if thesubstrate according to the invention is has at least two particle sizefractions of at least two inorganic compounds. The particle size ratiomay be from 1:1 to 1:10 000, preferably from 1:1 to 1:100. The ratio ofthe amounts of the particle size fractions in the composition of step b)can preferably be from 0.01:1 to 1:0.01. The composition of step b) ispreferably a suspension, which is preferably an aqueous suspension. Thesuspension may preferably comprise a liquid selected from water,alcohol, acid or a mixture thereof.

In a further preferred embodiment, the inorganic compound of step b) canbe obtained by hydrolysis of a precursor of the inorganic compoundcontaining the metal and/or semimetal. The hydrolysis can be effected,for example, by water and/or alcohol. An initiator, which is preferablyan acid or base, which is preferably an aqueous acid or base, may bepresent during the hydrolysis.

The precursor of the inorganic compound is preferably selected frommetal nitrate, metal halide, metal carbonate, metal alcoholate,semimetal halide, semimetal alcoholate or a mixture thereof. Preferredprecursors are, for example, titanium alcoholates, such as, for example,titanium isopropylate, silicon alcoholates, such as, for example,tetraethoxysilane or zirconium alcoholates. Preferred metal nitratesare, for example, zirconium nitrate. In an advantageous embodiment, atleast half the molar ratio of water, steam or ice is present in thecomposition, relative to the hydrolysable precursor, based on thehydrolysable group of the precursor.

In a preferred embodiment, the composition of step b) is a sol. In apreferred embodiment, it is possible to use commercially available sols,such as, for example, titanium nitrate sol, zirconium nitrate sol orsilica sol.

Preferably, the drying of the composition in step c) is carried out byheating to a temperature of between 50° C. and 1000° C. In a preferredembodiment, drying is effected for 10 minutes to 5 hours at atemperature of 50° C. to 100° C.

In another preferred embodiment, drying is effected in step d) for 1second to 10 minutes at a temperature of 100° C. to 800° C.

is The drying of step c) can be effected by means of warmed air, hotair, infrared radiation, microwave radiation or electrically generatedheat.

In a preferred embodiment, R in the general formula (Z¹)Si(OR)₃ is analkyl radical having 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15,16, 17 and/or 18 carbon atoms.

In a preferred embodiment, the coating of step d) contains a secondsilane of the general formula (Z²)_(z)Si(OR)_(4−z), in which R is analkyl radical having 1 to 6 carbon atoms and Z² is H_(a)F_(b)C_(n), inwhich a and b are integers, all R may be identical or different,a+b=1+2n, z=1 or 2 and n is 1 to 16, or, where Z¹ is Gly, Z² is Am(Am=3-aminopropyl) with z=1. n is preferably 1, 2, 3, 4, 5, 6, 7, 8, 9,10, 11, 12, 13, 14, 15 and/or 16. In a preferred embodiment, R in thegeneral formula (Z²)Si(OR)₃ is an alkyl radical having 1, 2, 3, 4, 5, 6,7, 8, 9, 10, 11, 12, 13, 14, 15 and/or 16 carbon atoms.

In a further preferred embodiment, the coating of step d) contains3-glycidyloxypropyltriethoxysilane and/or3-glycidyloxypropyltrimethoxysilane as the slilane and/or3-aminopropyltrimethoxysilane and/or 3-aminopropyltriethoxysilane as thesecond silane. Preferably, the coating of step d) containstetraethoxysilane as the silane and a silane of the formula(H_(a)F_(b)C_(n))Si(OR)_(4−z) as the second silane, in which a and b areintegers, a+b=1+2n, z is 1 or 2, n is 1 to 16 and all R may be identicalor different, all R preferably being identical and containing 1 to 6carbon atoms.

It is further preferred if the coating of step d) containstetraethoxysilane, methyltriethoxysilane, octyltriethoxysilane and/orhexadecyltrimethoxysilane as the silane and/or3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyltriethoxysilane as thesecond silane.

In a preferred embodiment, the coating of step d) contains, as aninitiator, an acid or base which is preferably an aqueous acid or base.

Preferably, the surface of the oxide particles present in the coating ofstep d) is hydrophobic. Organic radicals X_(1+2n)C_(n) bonded to siliconatoms are preferably present on the surface of the oxide particles ofthe coating of step d), n being 1 to 20 and X being hydrogen and/orfluorine. The organic radicals may be identical or different. n ispreferably 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17,18, 19 and/or 20. The groups bonded to silicon atoms are preferablymethyl, ethyl, propyl, butyl and/or pentyl groups. In a particularlypreferred embodiment, trimethylsilyl groups are bonded to the surface ofthe oxide particles. The organic radicals can preferably be eliminatedand more preferably hydrolysed.

The oxide particles of the coating of step d) can be selected from theoxides of Ti, Si, Zr, Al, Y, Sn, Zn, Ce or mixtures thereof. The oxideparticles of the coating of step d) are preferably partly hydrolysedunder the reaction conditions of step d) on the surface of the oxideparticles. Reactive centres which react with the organic siliconcompounds of the coating of step d) preferably form thereby. Theseorganic silicon compounds may be covalently bonded to the oxideparticles by, for example, —O-bonds during the drying of step e). Theoxide particles are covalently crosslinked with the curing coatingthereby. The layer thickness of the curing coating can thereforesurprisingly be further increased.

The oxide particles may have a mean particle size of 10 to 1000 nm,preferably of 20 to 500 nm, more preferably of 30 to 250 nm. If thecoating is to be transparent and/or colourless, preferably only theoxide particles which have a mean particle size of 10 to 250 nm areused. The mean particle size relates to the particle size of the primaryparticles or, if the oxides are present as agglomerates, to the size ofthe agglomerates. The particle size is determined by light-scatteringmethods, for example by means of an apparatus of the type HORIBA LB 550®(from Retsch Technology).

In the coating of step d), the polymer preferably has a meanmass-average molecular weight of at least 3000 g/mol. Preferably, themean mass-average molecular weight is to at least 5000 g/mol, morepreferably at least 6000 g/mol and most preferably at least 10 000g/mol.

The polymer of the coating of step d) preferably has an average degreeof polymerization of at least 50. In a more preferred embodiment, theaverage degree of polymerization is at least 80, more preferably atleast 95 and most preferably at least 150. The polymer of the coating ofstep d) is preferably selected from polyamide, polyester, epoxy resins,melamine/formaldehyde condensate, urethane/polyol resin or mixturesthereof.

In step d), the coating is preferably applied to the substrate in anamount such that, after drying in step e), a layer of the dried coatinghaving a layer thickness of 0.05 to 10 μm is present on the substrate. Acoating of step d) having a layer thickness of 0.1 μm to 9 μm, morepreferably of 0.2 μm to 8 μm and most preferably of 0.3 μm to 7 μm ispreferably present on the dried substrate.

The drying of the coating in step e) can be carried out by any methodwhich is known to the person skilled in the art. In particular, thedrying can be carried out in an oven. More preferably, the drying iscarried out using a hot air oven, circulating-air oven or microwave ovenor by infrared irradiation. In particular, the drying can preferably becarried out using the methods and drying times of step c). In apreferred embodiment, the coating of step e) is dried by heating to atemperature between 50° C. and 1000° C.

In a more preferred embodiment, at least one further coating can beapplied before the application of the coating in step b) and/or d). Thisfurther coating may be, for example, a print. Such a print can beapplied by any printing process which is familiar to the person skilledin the art, in particular the offset printing process, flexographicprinting process, pad printing or inkjet printing process.

In a further embodiment, after application of the coating in step d), atleast one further coating can be applied. This further coating is notlimited and may be any coating which is known to the person skilled inthe art. In particular, this coating may also be a print. In this casetoo, the print can be applied by any method which is familiar to theperson skilled in the art, in particular the offset printing process,flexographic printing process, pad printing and inkjet printing process.

The barrier layer in step f) preferably has substantially no pores andmore preferably no pores after drying. In this context, the term poresis understood as meaning openings (pinholes) in the barrier layer.Barrier layers usually have substantially no pores.

The barrier layer in step f) preferably contains film-forming polymerswhich are preferably selected from synthetic resin dispersions,synthetic resin emulsions, polyvinyl alcohol, modified polyvinylalcohol, polyvinyl acetate, modified polyvinyl acetate, polymaleicanhydride, polyvinyl methyl ether, vinyl methyl ether/maleic anhydridecopolymer, polyvinyl butyl ether, vinyl butyl ether/styrene copolymer,polyurethane, melamine/formaldehyde condensate, urea/melamine condensateor mixtures thereof. The film-forming polymers can preferably be appliedas a solution, emulsion and/or dispersion.

The barrier layer applied on the back is intended to prevent substancesapplied on the barrier layer from being able to penetrate into thesubstrate and/or the layers applied thereon. Thus, by means of thebarrier layer, the coated substrate can be fastened to a very wide rangeof subsurfaces by a very wide range of techniques or substances. Thisfastening is preferably effected by adhesive bonding with suitableadhesives. More preferably, it is possible to use all adhesives whichare stated further below for the optional adhesive layer.

The barrier layer can preferably be applied from a liquid coatingmaterial. It is more preferable if the applied coating material fromwhich the barrier layer is applied is dried after application.

Preferably, one or more barrier layers can be applied.

The barrier layer preferably has a layer thickness in the dried state of1 to 100 μm, more preferably of 2 to 80 μm and most preferably of 3 to70 μm. More preferably, the barrier layer has a layer thickness in thedried state of 4 to 60 μm, more preferably of 5 to 50 μm and mostpreferably of 6 to 20 μm.

The adhesive layer optionally applied in step g) preferably contains anadhesive selected from the group consisting of dispersion adhesives,solvent adhesives, starch pastes, synthetic resin glues, cold glues,heat-seal adhesives, hotmelt adhesives, assembly glues, wallpaperpastes, physically setting adhesives, chemically setting adhesives,one-component adhesives, multicomponent adhesives, two-componentadhesives, aminoplast adhesives, phenoplast adhesives, contactadhesives, pressure-sensitive adhesives, reaction adhesives, plastisoladhesives, glues, urea resin glues or mixtures thereof.

The optional adhesive layer (step g) can preferably be applied from aliquid coating material. It is more preferable if the applied adhesivematerial from which the adhesive layer is applied is dried afterapplication. The adhesives can preferably be applied as a solution, anemulsion and/or dispersion. Alternatively, application of the adhesivesfrom a melt is possible.

The optional adhesive layer (step g) preferably has a layer thickness inthe dried state of 1 to 100 μm, more preferably of 2 to 80 μm and mostpreferably of 3 to 70 μm. More preferably, the optional adhesive layerhas a layer thickness in the dried state of 4 to 60 μm, more preferablyof 5 to 50 μm and most preferably of 6 to 20 μm.

Preferably, one or more optional adhesive layers may be applied.

The present invention furthermore relates to the coated substrate whichis obtainable by the abovementioned method.

The present invention furthermore relates to a method for applying theabovementioned coated substrate to a support substrate, comprising thesteps:

-   -   a) provision of a support substrate,    -   b) optional application of at least one layer containing at        least one adhesive (adhesive layer) to at least one side of the        support substrate and    -   c) adhesive bonding of the coated substrate to the support        substrate, the second side of the coated substrate pointing in        the direction of the support substrate and/or pointing in the        direction of the optionally applied adhesive layer of the        support substrate.

is If an adhesive layer was applied to more than one side of the supportsubstrate in step b), it is sufficient if the coated substrate isapplied only to at least one side of the support substrate. Afterapplication to the support substrate, the first side of the coatedsubstrate is visible on use of the support substrate in the intendedmanner.

If the coated substrate is to serve as edge protection, an adhesivelayer is preferably applied to at least two adjacent sides of thesupport substrate in step b).

The support substrate in step a) is preferably a flexible or rigidsubstrate which is preferably selected from a chipboard, raw chipboard,wood board, plastic panel, parquet floor, wood veneer, veneer orcombinations thereof.

If the coated substrate has an adhesive layer, preferably no adhesivelayer is applied on the support substrate in step b). Alternatively, ifthe coated substrate has no adhesive layer preferably an adhesive layeris applied on the support substrate in step b). However, it is alsopossible for an adhesive layer to be applied neither to the coatedsubstrate nor to the support substrate. In this case, the adhesivebonding of the coated substrate to the support substrate in step c) ispreferably effected by the action of elevated pressure and/or elevatedtemperature, and the coated substrate is preferably adhesively bonded tothe support substrate thereby.

The optional adhesive layer of step b) preferably contains an adhesiveselected from the group consisting of dispersion adhesives, solventadhesives, starch pastes, synthetic resin glues, cold glues, heat-sealadhesives, hotmelt adhesives, assembly glues, wallpaper pastes,physically setting adhesives, chemically setting adhesives,one-component adhesives, multicomponent adhesives, two-componentadhesives, aminoplast adhesives, phenoplast adhesives, contactadhesives, pressure-sensitive adhesives, reaction adhesives, plastisoladhesives, glues, urea resin glues or mixtures thereof.

The optional adhesive layer (step b) can preferably be applied from aliquid coating material. It is more preferred if the applied adhesivematerial from which the adhesive layer is applied is dried afterapplication. The adhesive can preferably be applied as solution,emulsion and/or dispersion. Alternatively, application of the adhesivefrom a melt is possible.

The optional adhesive layer (step b) preferably has a layer thickness inthe dried state of 1 to 100 μm, more preferably of 2 to 80 μm and mostpreferably of 3 to 70 μm. More preferably, the optional adhesive layerhas a layer thickness in the dried state of 4 to 60 μm, more preferablyof 5 to 50 μm and most preferably of 6 to 20 μm.

Preferably, one or more optional adhesive layers may be applied.

The adhesive bonding of the coated substrate to the support substrate instep c) is preferably effected with the use of elevated pressure and/orelevated temperature. The adhesive bonding is preferably effected bypressing on.

The pressure during the adhesive bonding in step c) is preferably 1 to100 N/m², more preferably 2 to 75 N/m² and most preferably 3 to 50 N/m².More preferably, the pressure during the adhesive bonding in step c) is4 to 30 N/m², more preferably 5 to 25 N/m² and most preferably 6 to 20N/m².

The temperature during the adhesive bonding in step c) is preferably 30to 300° C., more preferably 40 to 250° C. and most preferably 50 to 220°C.

The duration of pressing of the coated substrate onto the supportsubstrate is preferably 1 second to 60 minutes, more preferably 30seconds to 50 minutes and most preferably 1 minute to 40 minutes.

The pressure during the adhesive bonding, the temperature and also theduration of pressing on may vary depending on the adhesive used.

The coated substrate and the support substrate are preferablysubstantially thermally stable and more preferably thermally stableunder the adhesive bonding conditions of step c).

The coated support substrate is preferably a floor panel and/or veneer.It is also possible to apply the coated substrate as edge protection ona support substrate. Articles provided with a veneer according to theinvention may also be furniture, furniture components, doors and/orwindows.

Coated substrates and coated support substrates of the present inventionsurprisingly exhibit very high flexibility. If the substrate isflexible, the substrate can be bent without the applied coatings beingdestroyed or torn. In particular, coatings can thus be applied toflexible tiles which adapt to the surface structure of a subsurfacewithout the coating being adversely affected. As already stated, a verywide range of protective layers can be applied as a coating, inparticular layers for protecting from aggressive chemicals ordirt-repellent coatings.

In addition, it is surprisingly found that thicker coatings can beapplied by means of the method of the present invention, application ina multicoat method being avoided. This proves to be advantageous inparticular if scratch-resistant layers are applied to polymericsheet-like structures. It is also surprising that the coated substrateof the present invention is reversibly extensible and scourable.

The coated support substrates of the present invention and in particularthe preferred floor panels and/or veneers have a scratch-resistant andchemical-resistant surface. In this respect, they are superior to coatedsupport substrates of the prior art.

EXAMPLES Example According to the Invention: Production of the CoatedSubstrate: Preparation of the Composition:

674.56 g of distilled water, 271.48 g of ethanol (96% strength) and93.376 g of concentrated nitric acid are initially introduced into astirred container. 11.97 g of Dolapix CE 64 (organic dispersant anddeflocculant (polyelectrolyte) for deflocculating oxide ceramic,manufacturer: Zschimmer & Schwarz GmbH & Co. KG, D-56112 Lahnstein) areadded to this mixture with stirring.

Thereafter in each case 518.04 g of the aluminas MZS 1 and MZS 3 fromMartinswerke are dispersed in succession in the mixture, and the mixtureobtained is stirred for a further 12 h.

16.66 g of tetraethoxysilane, 16.66 g of methyltriethoxysilane and 33.32g of glycidyloxipropyltrimethoxysilane are added to the dispersion andstirring is effected for 24 h.

2.117 g of 25% strength ammonia solution are added to the dispersion andthe dispersion is then applied to a PET nonwoven (polyethyleneterephthalate nonwoven, Freudenberg FK 22345) in an amount such that,after drying, a coat weight of 220 g/m² is present. The appliedcomposition is first dried at room temperature and then heated to 220°C. in an oven for 10 s. This composite serves as base material for thefollowing coating.

Production of the Second Coating:

298.95 g of glycidyloxypropyltriethoxysilane (GLYEO) are stirred with25.65 g of a 1.0% strength nitric acid in demineralized water until themixture is clear. Thereafter, 417.93 g of a 15% strength by weightdispersion of Aerosil R 812S in ethanol, denatured with methyl ethylketone, are added thereto. After stirring for one hour, 257.47 g of3-aminopropyltriethoxysilane (AMEO) are slowly added thereto. Thetemperature is limited to not more than 40° C. After the addition ofAMEO, stirring is continued for 18 hours at room temperature.

From the second coating material obtained, the coating is applied to thebase material by means of a knife coater. Drying is then effected for 30minutes at 120° C. The dry second coat mass is determinedgravimetrically as 30 g/m².

Production of the Barrier Layer:

The back of the nonwoven provided with the composition and coating iscoated with a synthetic resin dispersion (Wormalit VN 6035-22, HenkelKGaA) as a barrier layer using a knife coater. The layer thickness afterdrying at room temperature was about 8 μm.

When it is bent, the coated PET nonwoven shows very high flexibility.The applied layers do not flake off. Moreover, the coated PET nonwovenis very scratch-resistant, reversibly extensible and highly resistant toscouring according to DIN EN 259-1. The surface obtained is smooth andfree of cracks and has a silk gloss appearance. In addition, it is foundthat the pot life of the coating composition according to the inventionis substantially prolonged. Consequently, the coating compositionaccording to the invention can be more easily and effectively processed.

Production of the Coated Support Substrate: Support Substrate 1:

A polyvinyl acetate glue is manually applied to one side of a rawchipboard (19 mm thick) as a support substrate. On this raw chipboard,the coated PET nonwoven with the barrier layer is adhesively bonded tothe applied adhesive layer. This composite is heated at 60° C. for 10minutes by means of a heatable press in order to obtain the coatedsupport substrate 1.

Support Substrate 2:

A urea resin glue is manually applied to one side of a raw chipboard (19mm thick) as a support substrate (about 100 g/m² dry). On this rawchipboard, the coated PET nonwoven with the barrier layer is adhesivelybonded to the applied adhesive layer. This composite is heated at 90° C.for 5 minutes by means of a heatable press in order to obtain the coatedsupport substrate 2.

Production of the Coated Support Substrate as Edge Protection: EdgeProtection 1:

A hotmelt adhesive containing an EVA copolymer (about 200 g/m²) isapplied to an edge of a wood chipboard 19 mm thick. On this coated edge,the coated PET nonwoven with the barrier layer is applied to the appliedadhesive layer and the edge thus obtained is adhesively bondedmechanically at a temperature of 215° C. and under elevated pressure.

Edge Protection 2:

A hotmelt adhesive is applied to an edge comprising ABS plastic. On thiscoated edge, the coated PET nonwoven with the barrier layer is appliedto the applied adhesive layer and the edge thus obtained is adhesivelybonded mechanically at a temperature of 215° C. and under elevatedpressure.

The coated support substrates and edge protections of the presentinvention are very scratch-resistant, reversibly extensible and highlyresistant to scouring according to DIN EN 259-1. The surfaces obtainedare smooth, free of cracks and glossy. The edge obtained is not tornopen.

1: A method for coating substrates, comprising: a) applying acomposition to a first side of a substrate, the composition comprisingan inorganic compound and the inorganic compound comprising at least onemetal and/or semimetal selected from the group consisting of Sc, Y, Ti,Zr, Nb, V, Cr, Mo, W, Mn, Fe, Co, B, Al, In, TI, Si, Ge, Sn, Zn, Pb, Sb,Bi and mixtures thereof, and at least one element selected from thegroup consisting of Te, Se, S, O, Sb, As, P, N, C, Ga and mixturesthereof, b) drying of the composition, c) applying at least one coatingto the first side of the substrate to which the composition has beenapplied, the coating comprising a silane of the is general formula(Z1)Si(OR)3, in which Z1 is R, OR or 3-glycidyloxypropyl and R is analkyl radical having 1 to 18 carbon atoms and all R may be identical ordifferent, oxide particles selected from the group consisting of oxidesof Ti, Si, Zr, Al, Y, Sn, Zn, Ce and mixtures thereof, a polymer and aninitiator, and d) drying the coating, and e) applying at least onebarrier layer to a second side of the substrate. 2: The method accordingto claim 1, wherein the substrate is a flexible and/or rigid substrate.3: The method according to claim 1, wherein the substrate is a knittedfabric, a woven fabric, a mesh, a film, a sheet-like structure and/or ametal sheet. 4: The method according to claim 1, wherein the substrateis substantially thermally stable at a temperature greater than 100° C.5: The method according to claim 1, wherein the substrate issubstantially thermally stable during drying of the composition appliedto a first side of the substrate and/or the coating. 6: The methodaccording to claim 1, wherein the inorganic compound is selected fromthe group consisting of TiO2, Al2O3, SiO2, ZrO2, Y2O3, BC, SiC, Fe2O3,SiN, SiP, aluminosilicates, aluminium phosphates, zeolites, partlyexchanged zeolites and mixtures thereof. 7: The method according toclaim 1, wherein the inorganic compound has a particle size of 1 nm to10 000 nm. 8: The method according to claim 1, wherein the compositionapplied to a first side of the substrate is a suspension. 9: The methodaccording to claim 1, wherein the inorganic compound is obtained byhydrolysis of a precursor of the inorganic compound comprising the metaland/or semimetal. 10: The method according to claim 9, wherein theprecursor of the inorganic compound is selected from the groupconsisting of metal nitrate, metal halide, metal carbonate, metalalcoholate, semimetal halide, semimetal alcoholate and mixtures thereof.11: The method according to claim 1, wherein the composition applied toa first side of the substrate comprises an initiator. 12: The methodaccording to claim 11, wherein the initiator is an acid or base. 13: Themethod according to claim 1, wherein the composition is a sol. 14: Themethod according to claim 1, wherein drying of the composition appliedto a first side of the substrate is carried out by heating to atemperature between 50° C. and 1000° C. 15: The method according toclaim 1, wherein the coating comprises a second silane of the generalformula (Z2)zSi(OR)4−z, in which R is an alkyl radical having 1 to 8carbon atoms and Z2 is HaFbCn, a and b being integers, all R may beidentical or different, a+b=1+2n, z=1 or 2 and n is 1 to 16, or, whereZ1 is 3-glycidyloxypropyl, Z2 is 3-aminopropyl with z=1. 16: The methodaccording to claim 1, wherein the coating comprises3-glycidyloxypropyltriethoxysilane and/or3-glycidyloxypropyltrimethoxysilane as the silane and/or3-aminopropyltrimethoxysilane and/or 3-aminopropyltriethoxysilane as thesecond silane. 17: The method according to claim 1, wherein the coatingcomprises tetraethoxysilane as the silane and a silane of the formula(HaFbCn)zSi(OR)4−z as the second silane, in which a and b are integers,a+b=1+2n, z is 1 or 2, n is 1 to 16 and all R may be identical ordifferent. 18: The method according to claim 1, wherein the coatingcomprises tetraethoxysilane, methyltriethoxysilane, octyltriethoxysilaneand/or hexadecyltrimethoxysilane as the silane and/or3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyltriethoxysilane as thesecond silane. 19: The method according to claim 1, wherein the coatingcomprises, as an initiator, an acid or base. 20: The method according toclaim 1, wherein the surface of the oxide particles present in thecoating is hydrophobic. 21: The method according to claim 1, whereinorganic radicals X1+2nCn bonded to silicon atoms are present on thesurface of the oxide particles of the coating, n being 1 to 20 and Xbeing hydrogen and/or fluorine. 22: The method according to claim 1,wherein the polymer of the coating has a mean mass-average molecularweight of at least 3000 g/mol. 23: The method according to claim 1,wherein the polymer of the coating has an average degree ofpolymerization of at least
 50. 24: The method according to claim 1,wherein the polymer of the coating is selected from the group consistingof polyamide, polyester, epoxy resins, melamine/formaldehyde condensate,urethane/polyol resin and mixtures thereof. 25: The method according toclaim 1, wherein the coating is applied to the substrate in an amountsuch that, after drying, a layer of the dried coating having a layerthickness of 0.05 to 10 μm is present on the substrate. 26: The methodaccording to claim 1, wherein before application of the composition to afirst side of the substrate or the coating, at least one pre-coating isapplied. 27: The method according to claim 1, wherein after applicationof the coating, at least one post-coating is applied. 28: The methodaccording to claim 1, wherein the drying of the coating is carried outby heating to a temperature between 50° C. and 1000° C. 29: The methodaccording to claim 1, wherein the barrier layer is a layer which hassubstantially no pores. 30: The method according to claim 1, wherein thebarrier layer comprises at least one film-forming polymer selected fromthe group consisting of synthetic resin dispersions, synthetic resinemulsions, polyvinyl alcohol, modified polyvinyl alcohol, polyvinylacetate, modified polyvinyl acetate, polymaleic anhydride, polyvinylmethyl ether, vinyl methyl ether/maleic anhydride copolymer, polyvinylbutyl ether, vinyl butyl ether/styrene copolymer, polyurethane,melamine/formaldehyde condensate, urea/melamine condensate and mixturesthereof. 31: The method according to claim 1, wherein the adhesive layercomprises an adhesive selected from the group consisting of dispersionadhesives, solvent adhesives, starch pastes, synthetic resin glues, coldglues, heat-seal adhesives, hotmelt adhesives, assembly glues, wallpaperpastes, physically setting adhesives, chemically setting adhesives,one-component adhesives, multicomponent adhesives, two-componentadhesives, aminoplast adhesives, phenoplast adhesives, contactadhesives, pressure-sensitive adhesives, reaction adhesives, plastisoladhesives, glues, urea resin glues and mixtures thereof. 32: A methodfor applying the coated substrate of claim 1 to a support substrate,comprising: applying at least one layer comprising at least one adhesiveon at least one side of the support substrate and adhesively bonding thecoated substrate to the support substrate, the second side of the coatedsubstrate pointing in the direction of the support substrate and/orpointing in the direction of the applied adhesive layer of the supportsubstrate. 33: The method according to claim 32, wherein the supportsubstrate is a flexible or rigid substrate. 34: The method according toclaim 32, wherein the support substrate is selected from the groupconsisting of a chipboard, raw chipboard, wood board, plastic panel,parquet floor, wood veneer, veneer and combinations thereof. 35: Themethod according to claim 32, wherein the adhesive layer comprises anadhesive selected from the group consisting of dispersion adhesives,solvent adhesives, starch pastes, synthetic resin glues, cold glues,heat-seal adhesives, hotmelt adhesives, assembly glues, wallpaperpastes, physically setting adhesives, chemically setting adhesives,one-component adhesives, multicomponent adhesives, two-componentadhesives, aminoplast adhesives, phenoplast adhesives, contactadhesives, pressure-sensitive adhesives, reaction adhesives, plastisoladhesives, glues, urea resin glues and mixtures thereof. 36: The methodaccording to claim 32, wherein the adhesive bonding of the coatedsubstrate to the support substrate is effected with the use of elevatedpressure and/or elevated temperature. 37: A coated substrate obtained bythe method according to claim
 1. 38: A coated support substrate obtainedby the method according to claim
 32. 39: The coated support substrateaccording to claim 38, wherein the coated support substrate is a floorpanel and/or veneer. 40: The method according to claim 1, furthercomprising applying at least one layer comprising at least one adhesiveto the barrier layer.